Materials for Advanced Packaging (Record no. 11580)
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000 -LEADER | |
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fixed length control field | 05009nam a22005895i 4500 |
001 - CONTROL NUMBER | |
control field | 978-3-319-45098-8 |
003 - CONTROL NUMBER IDENTIFIER | |
control field | DE-He213 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20211209120329.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 161118s2017 gw | s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9783319450988 |
040 ## - CATALOGING SOURCE | |
Transcribing agency | AIKTC-KRRC |
041 ## - LANGUAGE CODE | |
Language code of text/sound track or separate title | ENG |
072 #7 - SUBJECT CATEGORY CODE | |
Subject category code | TJF |
Source | bicssc |
072 #7 - SUBJECT CATEGORY CODE | |
Subject category code | TEC008000 |
Source | bisacsh |
072 #7 - SUBJECT CATEGORY CODE | |
Subject category code | TJF |
Source | thema |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.381 |
Edition number | 23 |
245 10 - TITLE STATEMENT | |
Title | Materials for Advanced Packaging |
Medium | [electronic resource] / |
250 ## - EDITION STATEMENT | |
Edition statement | 2nd ed. 2017. |
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
Place of production, publication, distribution, manufacture | Cham : |
Name of producer, publisher, distributor, manufacturer | Springer International Publishing : |
-- | Imprint: Springer, |
Date of production, publication, distribution, manufacture, or copyright notice | 2017. |
300 ## - PHYSICAL DESCRIPTION | |
Extent | XVI, 969 p. 700 illus., 440 illus. in color. |
Other physical details | | Binding - Card Paper | |
336 ## - CONTENT TYPE | |
Content type term | text |
Content type code | txt |
Source | rdacontent |
337 ## - MEDIA TYPE | |
Media type term | computer |
Media type code | c |
Source | rdamedia |
338 ## - CARRIER TYPE | |
Carrier type term | online resource |
Carrier type code | cr |
Source | rdacarrier |
347 ## - DIGITAL FILE CHARACTERISTICS | |
File type | text file |
Encoding format | |
Source | rda |
520 ## - SUMMARY, ETC. | |
Summary, etc. | This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | EXTC Engineering |
9 (RLIN) | 4619 |
653 ## - INDEX TERM--UNCONTROLLED | |
Uncontrolled term | Electronics and Microelectronics, Instrumentation. |
653 ## - INDEX TERM--UNCONTROLLED | |
Uncontrolled term | Nanotechnology and Microengineering. |
653 ## - INDEX TERM--UNCONTROLLED | |
Uncontrolled term | Metallic Materials. |
653 ## - INDEX TERM--UNCONTROLLED | |
Uncontrolled term | Optical and Electronic Materials. |
700 1# - ADDED ENTRY--PERSONAL NAME | |
Personal name | Lu, Daniel. |
Relator term | editor. |
Relator code | edt |
-- | http://id.loc.gov/vocabulary/relators/edt |
700 1# - ADDED ENTRY--PERSONAL NAME | |
Personal name | Wong, C.P. |
Relator term | editor. |
Relator code | edt |
-- | http://id.loc.gov/vocabulary/relators/edt |
710 2# - ADDED ENTRY--CORPORATE NAME | |
Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY | |
Title | Springer Nature eBook |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
Relationship information | Printed edition: |
International Standard Book Number | 9783319450971 |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
Relationship information | Printed edition: |
International Standard Book Number | 9783319450995 |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
Relationship information | Printed edition: |
International Standard Book Number | 9783319832098 |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-45098-8 |
Public note | Click here to access eBook in Springer Nature platform. (Within Campus only.) |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | eBooks |
Source of classification or shelving scheme |
No items available.