Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (Record no. 12911)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04201nam a22005895i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-77872-3 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20211129152211.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 180427s2018 gw | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9783319778723 |
| 040 ## - CATALOGING SOURCE | |
| Transcribing agency | AIKTC-KRRC |
| 041 ## - LANGUAGE CODE | |
| Language code of text/sound track or separate title | ENG |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TGP |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC020000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TGP |
| Source | thema |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 670 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Seok, Seonho. |
| Relator term | author. |
| Relator code | aut |
| -- | http://id.loc.gov/vocabulary/relators/aut |
| 245 10 - TITLE STATEMENT | |
| Title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| Medium | [electronic resource] : |
| Remainder of title | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2018. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Cham : |
| Name of producer, publisher, distributor, manufacturer | Springer International Publishing : |
| -- | Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2018. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | VIII, 115 p. 106 illus. |
| Other physical details | | Binding - Card Paper | |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS | |
| File type | text file |
| Encoding format | |
| Source | rda |
| 490 1# - SERIES STATEMENT | |
| Series statement | Springer Series in Advanced Manufacturing, |
| International Standard Serial Number | 1860-5168 |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Mechanical Engineering |
| 9 (RLIN) | 4626 |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | Manufacturing, Machines, Tools, Processes. |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | Nanotechnology and Microengineering. |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | Characterization and Evaluation of Materials. |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | Tribology, Corrosion and Coatings. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer Nature eBook |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9783319778716 |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9783319778730 |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9783030085612 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | Springer Series in Advanced Manufacturing, |
| International Standard Serial Number | 1860-5168 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-77872-3 |
| Public note | Click here to access eBook in Springer Nature platform. (Within Campus only.) |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| Source of classification or shelving scheme | |
No items available.