| 000 | 05009nam a22005895i 4500 | ||
|---|---|---|---|
| 999 |
_c11580 _d11580 |
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| 001 | 978-3-319-45098-8 | ||
| 003 | DE-He213 | ||
| 005 | 20211209120329.0 | ||
| 008 | 161118s2017 gw | s |||| 0|eng d | ||
| 020 | _a9783319450988 | ||
| 040 | _cAIKTC-KRRC | ||
| 041 | _aENG | ||
| 072 | 7 |
_aTJF _2bicssc |
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| 072 | 7 |
_aTEC008000 _2bisacsh |
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| 072 | 7 |
_aTJF _2thema |
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| 082 | 0 | 4 |
_a621.381 _223 |
| 245 | 1 | 0 |
_aMaterials for Advanced Packaging _h[electronic resource] / |
| 250 | _a2nd ed. 2017. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2017. |
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| 300 |
_aXVI, 969 p. 700 illus., 440 illus. in color. _bCard Paper |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 520 | _aThis second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing. | ||
| 650 | 0 |
_aEXTC Engineering _94619 |
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| 653 | _aElectronics and Microelectronics, Instrumentation. | ||
| 653 | _aNanotechnology and Microengineering. | ||
| 653 | _aMetallic Materials. | ||
| 653 | _aOptical and Electronic Materials. | ||
| 700 | 1 |
_aLu, Daniel. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt |
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| 700 | 1 |
_aWong, C.P. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt |
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| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319450971 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319450995 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319832098 |
| 856 | 4 | 0 |
_uhttps://doi.org/10.1007/978-3-319-45098-8 _zClick here to access eBook in Springer Nature platform. (Within Campus only.) |
| 942 |
_cEBOOKS _2ddc |
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