000 04201nam a22005895i 4500
999 _c12911
_d12911
001 978-3-319-77872-3
003 DE-He213
005 20211129152211.0
008 180427s2018 gw | s |||| 0|eng d
020 _a9783319778723
040 _cAIKTC-KRRC
041 _aENG
072 7 _aTGP
_2bicssc
072 7 _aTEC020000
_2bisacsh
072 7 _aTGP
_2thema
082 0 4 _a670
_223
100 1 _aSeok, Seonho.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering
_h[electronic resource] :
_bWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
250 _a1st ed. 2018.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2018.
300 _aVIII, 115 p. 106 illus.
_bCard Paper
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringer Series in Advanced Manufacturing,
_x1860-5168
520 _aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
650 0 _aMechanical Engineering
_94626
653 _aManufacturing, Machines, Tools, Processes.
653 _aNanotechnology and Microengineering.
653 _aCharacterization and Evaluation of Materials.
653 _aTribology, Corrosion and Coatings.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319778716
776 0 8 _iPrinted edition:
_z9783319778730
776 0 8 _iPrinted edition:
_z9783030085612
830 0 _aSpringer Series in Advanced Manufacturing,
_x1860-5168
856 4 0 _uhttps://doi.org/10.1007/978-3-319-77872-3
_zClick here to access eBook in Springer Nature platform. (Within Campus only.)
942 _cEBOOKS
_2ddc