The scaling of standard single-gate bulk CMOS faces great challenge in the nanometer regime due to the severe short-channel effects (SCE) which causes significant increase in the leakage current. In this paper, a high-performance eight transistor (8T) SRAM has been proposed for reduction in leakage current and power consumption using double-gate FinFET with the proposed technique. Double gate FinFET has better SCEs performance compared to conventional CMOS. In this paper, a low-power 8T SRAM cell is designed with self-controllable voltage level (SVL) circuit for providing low power consumption and high performance. A self-controllable voltage level circuit can supply a maximum dc voltage when the load circuits are in active mode and it can also decrease the voltage supplied to a load circuit when the load circuit is in standby mode. This proposed technique significantly reduces the leakage current at a supply voltage of 0.9 V with a leakage reduction of value 0.46 nA in the leakage current of the circuit and provides high-performance SRAM cell. The following simulations have been done on SPICE tool on 32 nm technology.