Local cover image
Image from Google Jackets
Time Domain Analysis on Chip High Speed VLSI Optical Interconnection Network
Publication details: New Delhi STM Journals 2018Edition: Vol, 8(3), Sep- DecDescription: 36-44pSubject(s): Online resources: In: Journal of VLSI design tools & technology (JoVDTT)Summary: Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately, solve the communication problem, and to obtain high-performance integrated circuits. In this study, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to fulfill the requirements of silicon-based ICs must satisfy to successfully perform copper electrical interconnects (IEs).| Item type | Current library | Status | Barcode | |
|---|---|---|---|---|
Articles Abstract Database
|
School of Engineering & Technology Archieval Section | Not for loan | 2021-2021745 |
Total holds: 0
Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately, solve the communication problem, and to obtain high-performance integrated circuits. In this study, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to fulfill the requirements of silicon-based ICs must satisfy to successfully perform copper electrical interconnects (IEs).
There are no comments on this title.
Log in to your account to post a comment.
Click on an image to view it in the image viewer