Sharma, Abhishek
Time Domain Analysis on Chip High Speed VLSI Optical Interconnection Network - Vol, 8(3), Sep- Dec - New Delhi STM Journals 2018 - 36-44p.
Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately, solve the communication problem, and to obtain high-performance integrated circuits. In this study, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to fulfill the requirements of silicon-based ICs must satisfy to successfully perform copper electrical interconnects (IEs).
EXTC Engineering
Time Domain Analysis on Chip High Speed VLSI Optical Interconnection Network - Vol, 8(3), Sep- Dec - New Delhi STM Journals 2018 - 36-44p.
Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately, solve the communication problem, and to obtain high-performance integrated circuits. In this study, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to fulfill the requirements of silicon-based ICs must satisfy to successfully perform copper electrical interconnects (IEs).
EXTC Engineering